·Online fully automatic high-speed plasma cleaning+coding (optional)+code reading detection (optional) equipment · High cost-effectiveness: integrated rack design, stable mechanism; Controlled by upper computer software, it automatically completes Mark point recognition and positioning, plasma processing, coding, and code reading processes, resulting in higher efficiency; Using international top-level components to reduce the occurrence rate of failures, greatly reduce usage costs, minimize vulnerable parts, save purchase costs, and improve productivity: reduce manual intervention, improve equipment utilization rate, multifunctional assembly, plasma treatment to enhance coding effect and post solder paste printing quality, and improve yield rate
·Online fully automatic high-speed plasma cleaning+coding (optional)+code reading detection (optional) equipment
·High cost-effectiveness: integrated rack design, stable mechanism; Controlled by upper computer software, it automatically completes Mark point recognition and positioning, plasma processing, coding, and code reading processes, resulting in higher efficiency; Using top international components to reduce costs
The occurrence rate of minor faults greatly reduces the cost of use, reduces vulnerable parts, and saves procurement costs
·Improve productivity: reduce manual intervention, increase equipment utilization rate, multifunctional assembly, plasma treatment to enhance coding effect and post solder paste printing quality, improve yield rate

Application scope
Applied to surface plasma treatment and spray printing of various types of PCBs, FPCs, Mini LED substrates, metal shielding covers, and other materials; Capable of rotating multiple angles for printing; Ink can be sprayed and dried immediately. The printed content can be wiped with alcohol before reflow soldering. After high-temperature curing in the furnace, the ink can resist alcohol, friction, and IPA corrosion.
