Application of plasma cleaning in electronic manufacturing:

PCB/FPC is an important component of electronic products. Plasma surface treatment technology can be used in the manufacturing of PCB/FPC. Through plasma treatment, oxides and impurities on the surface of PCB/FPC can be removed, improving the conductivity and corrosion resistance of PCB/FPC, thereby enhancing the reliability and stability of electronic products.

At the same time, plasma surface treatment technology can be used in SMT manufacturing. Through plasma treatment, oxides and impurities on the surface of electronic components can be removed, improving the soldering performance and reliability of electronic components.

1. PCB/FPC substrate pad cleaning and activation

2. Cleaning before solder paste printing

3. Cleaning before dispensing, filling, and bonding

4. Cleaning before three proof coating